- Other PCB & PCBA[10]
- Rigid PCB[6]
- Multilayer PCB[10]
- Double-Sided PCB[10]
- Contact Person : Ms. Ma Sunny
- Company Name : Shenzhen Hongmy Precision Circuit Co., Ltd.
- Tel : 86-755-26954084-606
- Fax : 86-755-86372653
- Address : Guangdong,Shenzhen,B4-5 building,yanchuan north industial park, Songgang Town, Bao'an District, Shenzhen
- Country/Region : China
- Zip : 518105
CEM-1 PCB with 1 layer
1) material : Aluminium material,FR4 PCB board
2) function: for LED light and all electronic products
3) copper thickness: 1oz copper
4) thickness: 1.6mm thickness
5) about 200staff members
Our PCB are using for wide range of electronic products, such as project, amplifier, CCTV, power supply, GPS,
Set-top box, medical device, Telecommunication, LED light and so on.
1,Our Product rangeWe offer a wide range of PCBs such as single-sided, double-sided, multi-layer, high frequency, MCPCB, metal-backed PCB and so on.2, Product qualityOur factories got ISO9001, UL certificates and our products meet RoHS standards.
ROHS:A001C100827049001-2 SGS:CANEC1000312001UL:E3200453, How can we help you?What we offer is better solutions to help you improve your quality while maintaining low production cost and be your longtime partner.
The following is our ability specifications:
Item | Manufacture Capability | |
Material | FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-1, Aluminium, Metal based | |
Layer No. | 1-16 | |
Finished Board thickness | 0.2 mm-3.8mm’(8 mil-150 mil) | |
| ||
Board Thickness Tolerance | ±10% | |
Cooper thickness | 0.5 OZ-6OZ (18 um-210 um) | |
Copper Plating Hole | 18-40 um | |
Impedance Control | ±10% | |
Warp&Twist | 0.70% | |
Peelable | 0.012"(0.3mm)-0.02’(0.5mm) | |
Images | ||
Min Trace Width (a) | 0.075mm (3mil) |
|
Min Space Width (b) | 0.1mm (4 mil) | |
Min Annular Ring | 0.1mm (4 mil) |
|
SMD Pitch (a) | 0.2 mm(8 mil) |
|
BGA Pitch (b) | 0.2 mm (8 mil) | |
| 0.05mm | |
Solder Mask | ||
Min Solder Mask Dam (a) | 0.0635 mm (2.5mil) |
|
Soldermask Clearance (b) | 0.1mm (4 mil) | |
Min SMT Pad spacing (c) | 0.1mm (4 mil) | |
Solder Mask Thickness | 0.0007"(0.018mm) | |
Holes | ||
Min Hole size (CNC) | 0.2 mm (8 mil) | |
Min Punch Hole Size | 0.9 mm (35 mil) | |
Hole Size Tol (+/-) | PTH:±0.075mm;NPTH: ±0.05mm | |
Hole Position Tol | ±0.075mm | |
Plating | ||
HASL | 2.5um | |
Lead free HASL | 2.5um | |
Immersion Gold | Nickel 3-7um Au:1-5u'' | |
OSP | 0.2-0.5um | |
Outline | ||
Panel Outline Tol (+/-) | CNC: ±0.125mm, Punching: ±0.15mm | |
Beveling | 30°45° | |
Gold Finger angle | 15° 30° 45° 60° | |
Certificate | ROHS, ISO9001:2008, SGS, UL certificate. | |
CEM-1 PCB with 1 layer
